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Hyperscript

"Electronic Materials"

© H. Föll

Matrix of Modules

Hyperscripts of AMAT:
General Information

Index
 
This matrix contains all modules (i.e. HTML files) of the Hyperscript. Incomplete modules will be finished and more modules will be added in due time. There are three main levels for organizing the modules:
Basics
Contains some reference information and on occasion longer texts on background knowledge that you should be familiar with.
Learning (main part)
Contains everything that you should know after taking the course.
Advanced
Supplies knowledge beyond the scope of the course that is of some interest. Includes, on occasion, also elaborations about historical, strange or funny stuff relating to topics of the course.
The main part ("learning") is further subdivided in 4 (vertical) columns and the (horizontal) chapters and sub-chapters which define the matrix. The columns "backbone I" and "backbone II" constitute the hard core of the Hyperscript; the columns "illustrations" and "exercises" intend to help in understanding and to practical applications of what has been learned.
The cells of the matrix contain all the modules, identified by their filename. The first letter of a filename has a specific meaning not important in this context. The numbers have the following meaning:
1. number = chapter
2. number = subchapter
3. number = running integer
 
Color coding of entries
Blue: Finished to a large degree
Red: Unfinished to a large degree
Dark green: Contains JAVA or animation
Light green: "Multiple Choice" Exercises
Purple: Required reading Module.
Pink: Summaries
 

Metafiles

  Contents Preface Books Running Term  
 
Basics Backbone I Backbone II Illustrations Exercises Advanced

1. Introduction

1.1 Scope of the Course

r1_1_1
General Remarks
r1_1_2
Seminar

i1_1_1
Google and ELMAT
p1_1_1
People forget
g1_1_2
Illustrating tables
g1_1_3
Skeleton foil


1.2 Introduction to the Course

r1_2_1
General Remarks
r1_2_2
Materials and Products

p1_2_1
Silicone vs. silicon

t1_2_1
t1_2_2
t1_2_3
t1_2_4
t1_2_5
t1_2_6
t1_2_7
oral presentations
t1_2_8
Check list
1.3 Required Reading and Exercises
  r1_3_1
General Remarks
r1_3_2
Ohms Law 1
r1_3_3
Ohms Law 2
r1_3_4
Hall effect
r1_3_5
Averaging vectors
    e1_3_1
Numbers µ
s1_3_1
Solution e1_3_1
e1_3_2
Numbers v0, t, l
s1_3_2
Solution e1_3_1
e1_3_3
4 Ghz processor
s1_3_3
Solution e1_3_3
c1_3_1
Conductivity 1
c1_3_2
Conductivity 2
c1_3_3
Hall effect
 

2. Conductors

2.1 Definition and General Properties
b2_1_3
Function generator
r2_1_1
Metals
r2_1_2
Alloys
r2_1_3
Non-metals
r2_1_4
Summary
  t2_1_1
Prop. Metals
t2_1_2
Resid. resistance Na
g2_1_1
Al on different substr.
g2_1_2
r von T
e2_1_1
Quizzes to battery
c2_1_1
Metals
c2_1_2
Alloys
c2_1_3
Non-metals
c2_1_4
mc summary
t2_1_1
Requirements ICs
t2_1_2
Forgetting r(T)
t2_1_3
Li ion battery
Stanford Paper
Kiel Paper
2.2 General Applications
  r2_2_1
Conductors
r2_2_2
Contacts
r2_2_3
Resistors and Heating
r2_2_4
Summary
  t2_2_1
Properties Cu alloys
t2_2_2
Ag based contacts
t2_2_3
Phase diagram
t2_2_4
Conducting polymer
t2_2_5
Heating elements
t2_2_6
MoSi heater
g2_2_1
Max. T heating elem.
c2_2_1
Applications

2.3 Special Applications
  r2_3_1
Thermionic Emission
r2_3_2
Field enhanced/Tunneling
r2_3_3
Thermoelectric Effects
r2_3_4
Summary
    e2_3_1
Richardson Equation
s2_3_1
Solution e2_3_1
c2_3_1
Electron emission
c2_3_3
Thermionic Effects
c2_3_4
mc summary
t2_3_1
Tunneling
t2_3_2
Thermoelectric effects
2.4 Ionic Conductors



r2_4_1
General Remarks
r2_4_2
Debye Length
r2_4_3
Nernsts Law
r2_4_4
Summary

e2_4_1
Field Screening
s2_4_1
Solution e2_4_2
e2_4_2
Nernst equation
s2_4_2
Solution e2_4_1
c2_4_4
Ionic conductors

  2.5 Summary Conductors
r2_5_1
c2_5_1
Conductors mc summary
 

3. Dielectrics

3.1 Definitions and General Relations
b3_1_1
Gauss law
r3_1_1
Basics
r3_1_2
Summary


c3_1_1
Dielectrics general

3.2 Polarisation Mechanisms
b3_2_1
Attraction point - sphere
b3_2_2
Spherical Coordinates
r3_2_1
General remarks
r3_2_2
Electronic polarization
r3_2_3
Ionic polarization
r3_2_4
Orientation polarization
r3_2_5
Summary/generalization
r3_2_6
Clausius-Mosotti
r3_2_7
Summary

i3_2_1
Values for er
t3_2_1
Mistakes in books

e3_2_1
Max. DK water
s3_2_1
Solution 3.2-1
e3_2_2
Interface polarization
s3_2_2
Solution 3.2-2
e3_2_3
Electronic polarization
s3_2_3
Solution 3.2-3
c3_2_1
Polarization mechanisms
c3_2_2
Electronic Polarization
c3_2_3
Ionic Polarization
c3_2_4
Orientation polarization
c3_2_5
Summary/generalization
c3_2_7
mc summary
t3_2_1
Paul Langevin
3.3 Frequency Dependence of the Dielectric Constant
b3_3_1
Harmonic oscillator
b3_3_2
Fourier transforms
b3_3_3
Complex notation
r3_3_1
General remarks
r3_3_2
Dipole relaxation
r3_3_3
Resonance
r3_3_4
Complete e(w)
r3_3_5
Summary
  t3_3_1
Dielectric function
c3_3_4
Complete e(w)
b3_3_1
Strange words
t3_3_1
Kramers-Kronig
t3_3_2
Beer and Relaxation
t3_3_3
Frequency dependence
3.4 Dynamic Properties
  r3_4_1
Dielectric losses
r3_4_2
Summary
    c3_4_1
Dielectric losses
t3_4_1
Cooking with microwaves
3.5 Electrical Breakdown and Failure
  r3_5_1
General
r3_5_2
Breakdown Mechanisms
r3_5_3
Summary
    c3_5_1
Dielectric breakdown
 
3.6 Special Dielectrics
  r3_6_1
Piezo electricity and relations
r3_6_2
Ferro electricity
r3_6_3
Summary
  i3_6_1
Piezoelectric fuel injector
c3_6_1
Piezo and Ferro electricity
t3_6_1
Piezo electricity
t3_6_2
Electrostriction
t3_6_3
ferro-electrics
t3_6_4
PZT
3.7 Dielectrics and Optics
b3_7_1
Basic optics
b3_7_2
Fresnel laws
  r3_7_1
Basics
r3_7_2
Complex index of refraction
r3_7_3
Uses of complex n
r3_7_4
mc summary
t3_7_1
Complex n Si
c3_7_1
Dielectrics and Optics - Basics

  3.8 Summary Dielectrics
r3_8_1
c3_8_1
Dielectrics mc summary
 

4. Magnetic Materials

4.1 Definitions and General Relations
b4_1_1
Comparison magn. - electr.
r4_1_1
Basics
r4_1_2
Dipole origin
r4_1_3
Classification
r4_1_4
Summary

i4_1_1
Magnetic moments atoms
c4_1_2
Dipole origin
c4_1_3
Classification
c4_1_4
mc summary
t4_1_1
Magnetic monopoles
t4_1_2
Total magnetic moment
t4_1_3
Ferromagnetic materials
4.2 Dia- and Paramagnetism

r4_2_1
Diamagnetism
r4_2_2
Paramagnetism
r4_2_3
Summary



t4_2_1
Diamagnetism
t4_2_2
Paramagnetism
4.3 Ferromagnetism

r4_3_1
Mean field theory
r4_3_2
Beyond mean field
r4_3_3
Magnetic domains
r4_3_4
Domain movement
r4_3_5
Losses; frequency
r4_3_6
Hard/soft magnets
r4_3_7
Summary

i4_3_1
Domain structures
e4_3_1
Max. magnetization
s4_3_1
Solution 4.3-1
e4_3_2
Magnetic moments Fe, Ni, Co
s4_3_2
Solution 4.3-2
c4_3_1
Mean field theory
c4_3_3
Magnetic domains
c4_3_4
Domain movement
c4_3_5
Losses and frequency
c4_3_7
mc summary
t4_3_1
QT of ferromagnetism
t4_3_2
Giant magnetostriction
t4_3_3
Hystereses losses
t4_3_4
Complex permeability
t4_3_5
Magnetostriction
4.4 Technical Materials and Applications
  r4_4_1
Magnetic materials
r4_4_2
Magnetic data storage
r4_4_3
Summary
  i4_4_1
Permanent magnets
c4_4_1
Applications
 
  4.5 Summary Magnetic Materials -
r4_5_1
c4_5_1
mc Summary
 

5. General Aspects of Silicon Technology

5.0 Required Reading

r5_0_1
Basic bipolar
r5_0_2
Basic MOS
r5_0_3
Summary
    c5_0_1
Required reading
 
5.1 Basic Considerations for Process Integration
b5_1_1
RC time constant

r5_1_1
What is integration?
r5_1_2
Integrating transistors
r5_1_3
Integrating connections
r5_1_4
MOS transistors
r5_1_5
Integrated CMOS
r5_1_6
Summary

i5_1_1
Cross section DRAM
c5_1_1
What is integration?
c5_1_2
Integrating transistors
c5_1_3
Integrating connections
c5_1_4
Integrated MOS transistor
c5_1_5
Integrated CMOS
c5_1_6
mc summary
t5_1_1
Polyimide Story
5.2 Process Integration

r5_2_1
Chips on wafers
r5_2_2
Packaging
r5_2_3
Summary

i5_2_1
Processes + materials 1
i5_2_2
Processes + materials 2
i5_2_3
Processes + materials 3
i5_2_4
Flats
c5_2_1


5.3 Cleanrooms, Particles and Contamination
  r5_3_1
Cleanrooms
r5_3_2
Summary
  i5_3_1
Particles on chips
i5_3_2
Human particles
i5_3_3
Cleanroom garments
i5_3_4
Unexpected
i5_3_5
The air
  t5_3_1
Cleanroom
5.4 Development and Production of a New Chip Generation
    r5_4_1
Money and time
r5_4_2
Working in D+P
r5_4_3
Generation sequences
r5_4_4
Summary
i5_4_1
Moore law break down
i5_4_2
Cost of Chip production
i5_4_3
DRAM prizes
i5_4_4
First Silicon
i5_4_5
Chip size development
i5_4_6
Real yield curves
   
  5.5 General Aspects of Silicon Technology - Summary
r5_5_1
c5_5_1
mc Summary
 

6. Materials and Processes for Silicon Technology

6.1 Silicon

r6_1_1
Producing Silicon
r6_1_2
Silicon crystals and Wafers
r6_1_3
Other Silicon uses
r6_1_4
Summary

i6_1_1
CZ crystal growth
i6_1_2
Si crystal
i6_1_3
Complete wafer process
i6_1_4
Poly-Si Specs
i6_1_5
Wafer Specs
i6_1_6
Necking
c6_1_2
Si crystal and wafer
t6_1_1
Si crisis
t6_1_2
Crystal growth - science & art
t6_1_3
FZ crystal growth
t6_1_4
Biography Czochralski
Article
Historic review Si
Article
New developments Si crystals
6.2 Oxidation and Doping

r6_2_1
Oxidation
r6_2_2
LOCOS process
r6_2_3
Summary

i6_2_1
Forms of SiO2
i6_2_2
LOCOS with poly-Si
i6_2_3
HRTEM ONO
i6_2_4
Furnaces
c6_2_1
Si oxide
t6_2_1
Deal-Grove oxidation
t6_2_2
Complications - oxides
t6_2_3
Box insulation
t6_2_4
Oxide edge disl. and TEM
6.3 Chemical Vapor Deposition
  r6_3_1
Epitaxy
r6_3_2
Oxide CVD
r6_3_3
Nitride, Poly, rest CVD
r6_3_4
Summary
  i6_3_1
Poly-Si
c6_3_3
CVD general
t6_3_1
FOBIC
6.4 Physical Processes for Layer Deposition
  r6_4_1
Sputter deposition
r6_4_2
Ion implantation
r6_4_3
Miscellaneous techniques
r6_4_4
Summary
  i6_4_1
Defects after I2
c6_4_1
Sputter, contact hole
c6_4_2
Ion implantation
c6_4_3
Miscellaneous techniques
c6_4_4
mc summary
t6_4_1
Spiking
t6_4_2
Electromigration
t6_4_3
Sputter technologies
t6_4_4
Doping trenches
t6_4_5
I2 special
Article:
Eltran SOI
Article:
Eltran process
6.5 Etching Techniques
  r6_5_1
Chemical etching
r6_5_2
Plasma Etching
r6_5_3
Summary
  i6_5_1
Wet chemistry and money
  t6_5_1
Dry etch special
6.6 Lithography  
  r6_6_1
Basic lithography; reticles
r6_6_2
Resist, steppers
r6_6_3
Summary
      t6_6_1
CaF2 lens
t6_6_2
Advanced lithography
6.7 Mysterious Silicon - Unclear Properties and Present Day Research
    r6_7_1
Electrochemistry
r6_7_2
Summary
     
  6.8 Materials and Processes for Silicon Technology - Summary
r6_8_1
c6_8_1
mc Summary
 
 
Basics Backbone I Backbone II Illustrations Exercises Advanced
 
Module Count (finished modules only)
8 69 9 48 27 34
Grand Total: 195