Magnetron sputtering is a physical vapour deposition (PVD) technology for thin film deposition. The sputtering process is based on the bombardment of a target material with energetic particles (usually gas ions provided by a plasma, e.g. Ar) by what atoms from the target are ejected and deposited on the surface of the sample material. Our sputtering geometry consists of a direct current (DC) magnetron and a radio frequency (RF) magnetron allowing the deposition of a large variety of conductive as well as insulating materials, e.g. Au, Cu, ZnO, FeCoSiB, etc. Additionally, the arrangement of two magnetrons enables the deposition of compound materials by co-sputtering.

a) Geometry of the processing chamber with turbomolecular pump (1), sample holder (2), rotary shutter (3), vacuum gauge (4), DC magnetron (5), RF magnetron (6), window (7) and push-to-pull shutter (8).

b) Schematic image of the used sputtering geometry with DC magnetron (1), RF magnetron (2), sample holder (3), rotary shutter (4) and a push-to-pull shutter (5).

For more information contact:

Dr.-Ing. Sören Kaps

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