Processes and Materials II

Here is the rest of the processes
A few more materials are needed, especially solids in the form of "sputter targets".
A great total of about 450 process- and control steps are needed.
Materials 2
We don't have a chip yet - we only have unpackaged chips on a wafer.
Next, the wafer has to be cut and the chips that work (this needs a measurement) are packaged.
Packaging, although not needing processes at very small dimensions, is not simple either.
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© H. Föll (Electronic Materials - Script)