|Here is the rest of the processes
|A few more materials are needed, especially solids in the form of "sputter targets".
|A great total of about 450 process- and control steps are needed.
|We don't have a chip yet - we only have unpackaged chips on a wafer.
|Next, the wafer has to be cut and the chips that work (this needs a measurement) are packaged.
|Packaging, although not needing processes at very small dimensions, is not simple either.
|To continue, use the link
Processes and Materials I
Processes and Materials III
© H. Föll (Electronic Materials - Script)