Frame No Frame | # Hyperscript # "Semiconductor Technology" © H. Föll # Matrix of Modules | Hyperscripts of AMAT: General Information Index

| This matrix contains all modules (i.e. HTML files) of the Hyperscript. Incomplete modules will be finished and more modules will be added in due time. There are three main levels for organizing the modules:
|  | Basics Contains some reference information and on occasion longer texts on background knowledge that you should be familiar with.
|  | Learning (main part) Contains everything that you should know after taking the course.
|  | Advanced Supplies knowledge beyond the scope of the course that is of some interest. Includes, on occasion, also elaborations about historical, strange or funny stuff relating to topics of the course.
| The main part ("learning") is further subdivided in 4 (vertical) columns and the (horizontal) chapters and sub-chapters which define the matrix. The columns "backbone I" and "backbone II" constitute the hard core of the Hyperscript; the columns "illustrations" and "exercises" intend to help in understanding and to practical applications of what has been learned.
| The cells of the matrix contain all the modules, identified by their filename. The first letter of a filename has a specific meaning not important in this context. The numbers have the following meaning: 1. number=chapter 2. number=subchapter 3. number=running integer

| Color coding of entries
Fonts | Fixed Filenames
--- | ---
Blue | Module is finished. | r1_2_3 | Backbone: Module 3 in chapter 1.2
Red | Modul exists but is not finished | q1_2_1 | Excercises: "Quick questions" to chapter 1.2
Green | Module contains JAVA or animation | sq1_2_1 | Excercises: Solutions to "Quick questions"
Light green | "Multiple Choice" Exercises | e1_2_3 | Excercises: Third full exercise to chapter 1.2
Light blue | "Quick questions" Exercises | s1_2_3 | Excercises: Solution to third full exercise to chapter 1.2
Pink | Summaries | c1_2_1 | Excercises: "Multiple choice" to chapter 1.2

Basics | Backbone I | Backbone II | Illustrations | Exercises | Advanced
## 1. Introduction
1.1 Scope of the Course
| r1_1_1 General Remarks |  | i1_1_1 Products and components |  |
1.2 Introduction to the Course
| r1_2_1 Motivation for the Content |  |  |  |
## 2. Semiconductor Materials and Products
2.1 General Chemistry and Structure
| r2_1_1 Elemental Semiconductors r2_1_2 Compound Semiconductors general r2_1_3 Some relevant properties r2_1_4 Summary |  | i2_1_1 Sphalerite and Wurtzite | q2_1_1 Quick questions sq2_1_1 Solution to q2_1_1 | t2_1_1 Germanium t2_1_2 Selenium
2.2 Silicon
| r2_2_1 Si and microelectronics r2_2_2 Si other uses r2_2_3 Summary |  |  | q2_2_1 Quick questions sq2_2_1 Solution to q2_2_1 | t2_2_1 Exotic uses of Si
2.3 III-V Semiconductors
| r2_3_1 III-V and optoelectronics r2_3_2 II-VI other products r2_3_3 Summary |  |  | q2_3_1 Quick questions sq2_3_1 Solution to q2_2_1 | t2_3_1 III-V Highlights
2.4 Other Semiconductors and Related Products
| r2_4_1 Ge and SiC r2_4_3 II-VI semiconductors r2_4_3 Chalkogenides r2_4_4 Organic semiconductors r2_4_5 Summary |  |  | q2_4_1 Quick questions | t2_4_1 Layered semiconductors
2.5 Exotic Semiconductors, Processes and Products
|  | r2_5_1 Porous semiconductors r2_5_2 Metal Oxides |  |  |
2.6 Semiconductor Materials and Products - Summary
| r2_6_1 Summary | q2_6_1 All quick questions |
## 3. Thin Films
3.1 General
b3_1_1 Interference colors | r3_1_1 Remarks; Definitions r3_1_2 Applications r3_1_3 Summary |  |  | e3_1_1 Quick questions |
3.2 Mechanical Properties
| r3_2_1 Geometry and Topology r3_2_2 Adhesion r3_2_3 Stress and strain r3_2_4 Summary |  | i3_2_1 Thermal expansion coefficients pdf file Lab class "Oberflächenstrukturen" | e3_2_1 Quick questions | t3_2_1 Microcrack mysteries
3.3 Nucleation and Growth
| r3_3_1 In the beginning r3_3_2 Nucleation and growth r3_3_3 Summary |  | i3_3_1 STM / AFM pictures | e3_3_1 Quick questions | t3_3_1 Surface reconstruction t3_3_2 Nucleation theory
3.4 Structure, Interface and Some Properties
| r3_4_1 Epitaxy r3_4_2 Film structure r3_4_3 Film properties r3_4_4 Summary |  |  | e3_4_1 Quick questions |
3.5 Properties, Measurements and Characterization
|  | r3_5_1 General properties r3_5_2 Important techniques r3_5_3 Structural properties |  |  |
3.6 Thin Films - Summary
| r3_6_1 Summary | e3_6_1 All Quick questions |
## 4. Getting Started
4.1 Input to Si Processing in an Industrial Environment
| r4_1_1 The factory r4_1_2 Producing Poly Si r4_1_3 Si crystal and wafer r4_1_4 Summary |  | i4_1_1 Materials I i4_1_2 Materials II i4_1_3 Materials III i4_1_4 Commercial Poly Si specs. i4_1_5 CZ Crystal Growth i4_1_6 Necking i4_1_7 Finished crystal i4_1_8 Flats i4_1_9 Production process i4_1_10 Wafer specs | e4_1_1 Quick questions | t4_1_1 Si crisis in 2007 t4_1_2 Biography J. Czochralski t4_1_3 Science and art crystal growth t4_1_4 FZ crystal growth Article 1: History + development Si Article 2: New developments Si crystal growth
4.2 Other Semiconductor Crystal Growth Technologies
| r4_2_1 Other single crystals r4_2_2 No need for single crystals r4_2_3 Summary |  |  | e4_2_1 Quick questions | Article : SOI
4.3 Infrastructure
|  | r4_3_1 Cleanroom, particles, defects r4_3_2 Packaging, testing r4_3_3 working chip development r4_3_4 Generation sequence r4_3_5 Summary | i4_3_1 Air i4_3_2 Cleanroom garments i4_3_3 Dirty humans i4_3_4 particles i4_3_5 Broom i4_3_6 Emergence new chip i4_3_7 Chip size | e4_3_1 Quick questions | t4_3_1 Cleanroom
4.4 Getting Started - Summary
| r4_4_1 Summary | c4_4_1 All Multiple choice e4_4_1 All Quick questions |
## 5. Integrated Circuits - Process Integration
5.1 Basic Considerations for Process Integration
b5_1_1 Basic bipolar b5_1_2 Basic MOS b5_1_3 RC time constant | r5_1_1 What is integration? r5_1_2 Integrating transistors r5_1_3 Integrating connections r5_1_4 MOS transistors r5_1_5 Integrated CMOS r5_1_6 Summary |  | i5_1_1 Cross section DRAM | c5_1_6 Multiple choice e5_1_1 Transistors e5_1_6 Quick questions | t5_1_1 Polyimide Story
5.2 Process Integration
| r5_2_1 Chips on Wafers r5_2_2 Packaging chips r5_2_3 Summary |  | i5_3_1 Moore's law breakdown i5_3_2 Costs of Chip Production i5_3_3 Prize Decay i5_3_4 Yield development | c5_2_1 Multiple choice |
5.3 Money, Markets and Management
|  | r5_3_1 Money and Moore's law |  |  |
5.4 Integrated Circuits - Process Integration - Summary
| r5_4_1 Summary | c5_4_1 All Multiple choice e5_4_1 All Quick questions |
## 6. Materials and Processes for Silicon Technology
6.1 Si Oxides and LOCOS Process
| r6_1_1 Importance of Silicon Dioxide r6_1_2 LOCOS r6_1_3 Summary |  | i6_1_1 Forms of SiO2 i6_1_2 HRTEM SiO2 / ONO i6_1_3 Furnaces i6_1_4 LOCOS with poly | c6_1_1 Multiple choice | t6_1_1 Electrical break down t6_1_2 Box isolation t6_1_3 TEM LOCOS
6.2 Chemical Vapor Deposition
| r6_2_1 Si epitaxy r6_2_2 Oxide CVD r6_2_3 Other CVD r6_2_4 Summary |  | i6_2_1 TEM poly Si | c6_2_1 Multiple choice | t6_2_1 FOBIC
6.3 Physical Processes for Layer Deposition
| r6_3_1 Sputter deposition r6_3_2 Ion implantation r6_3_3 Miscellaneous techniques r6_3_4 Summary |  | i6_3_1 Requirements metallization i6_3_2 Amorphization | c6_3_1 Multiple choice | t6_3_1 Spiking t6_3_2 Electromigration t6_3_4 Doping trenches Article: Eltran process
6.4 Etching Techniques
| r6_4_1 General remarks r6_4_2 Chemical etching r6_4_3 Plasma etching r6_4_4 Summary |  | i6_4_1 Loosing money |  | t6_4_1 Dry etching
6.5 Lithography
| r6_5_1 Basic lithography; reticles r6_5_2 Resist, steppers r6_5_3 Summary |  |  |  | t6_5_1 Advanced lithography
6.6 Materials and Processes for Silicon Technology - Summary
| r6_6_1 Summary | c6_6_1 All Multiple choice |
## 7. Si MEMS
7.1 Products and Developments
| r7_1_1 What is MEMS? r7_1_2 Gyro close look r7_1_3 Sensors and Actuators r7_1_4 Summary |  | i7_1_1 MEMS market i7_1_2 DLP chip i7_1_3 pdf file Bosch g sensor | e7_1_1 Quick questions e7_1_2 Capacitors and Forces s7_1_2 Solution to e7_1_2 | t7_1_3 Casimir effect
7.2 Processes and Specialities
| r7_2_1 Processes, materials; general r7_2_1 Key processes r7_2_3 Process integration r7_2_4 Summary |  |  | e7_2_1 Quick questions | t7_2_1 Stiction
7.3 Si MEMS - Summary
| r7_3_1 Summary | e7_3_1 All quick questions |
## 8. Solar Cells
8.1 General Concerns
b8_1_1 Joules, Watts and kWh | r8_1_1 Basic Solar Cell Topics r8_1_2 Basic SC characteristics r8_1_3 Summary |  | pdf file Article: Smalley "Terawatt challenge" pdf file Article: Lewis "Powering the planet" | e8_1_1 Exponential growth s8_1_1 Solution to e8_1_1 e8_1_2 Optimal working point SC s8_1_2 Solution to e8_1_2 e8_1_3 Characteristics real SC s8_1_3 Solution to e8_1_2 e8_1_4 Quick questions e8_1_5 Diode / solar cell s8_1_5 Solution to e8_1_5 e8_1_6 log I vs. eU s8_1_6 Solution to e8_1_6 | t8_1_1 Two planets t8_1_2 FAQ's solar cells t8_1_3 Modules t8_1_4 CELLO t8_1_5 Series and parallel connection t8_1_6 Basic IU characteristics pdf file Lab class "IV characteristics" Articles: 1: CELLO basics 2. CELLO adv.
8.2 Making Bulk Si Solar Cells
| r8_2_1 Production; Silicon Starting Material r8_2_2 Processes and Integration r8_2_3 Summary |  |  | e8_2_1 Quick questions |
8.3 Making Thin Film Solar Cells
| r8_3_1 Types of thin film SC's r8_3_2 Producing thin film SC's r8_3_3 Summary |  | i8_3_1 Würth Solar | e8_3_1 Series connection s8_3_1 Solution to e8_3_1 e8_3_2 Quick questions |
8.4 Solar Cells - Summary
| r8_4_1 Summary | e8_4_1 All quick questions |
## 9. Optoelectronics
9.1 General Concerns
| r9_1_1 Semiconductors and Light r9_1_2 Optoelectronic Devices r9_1_3 Summary |  |  | e9_1_1 Quick questions | t9_1_1 Quasi particles
9.2 Important Principles and Technologies
| r9_2_1 LED's r9_2_2 Laser diodes r9_2_3 Summary |  | i9_2_1 MBE | e9_2_1 Quick questions | t9_2_1 Recombination channels t9_2_2 Cleaving semiconductors
9.3 Optoelectronics - Summary
| r9_3_1 Summary | e9_3_1 All quick questions |
Basics | Backbone I | Backbone II | Illustrations | Exercises | Advanced
Modul Count (finished moduls only) S=237
4 | 96 | 10 | 42 | 51 | 34
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