# Processes and Materials II

| Here is the rest of the processes
|  | A few more materials are needed, especially solids in the form of "sputter targets".
|  | A great total of about 450 process- and control steps are needed.

| We don't have a chip yet - we only have unpackaged chips on a wafer.
|  | Next, the wafer has to be cut and the chips that work (this needs a measurement) are packaged.
|  | Packaging, although not needing processes at very small dimensions, is not simple either.
|  | To continue, use the link

With frame

Processes and Materials I

Processes and Materials III

© H. Föll (Electronic Materials - Script)